product information

Brand: MIRTEC  
Model: MV-7L
Status: Brand new
Others: Online AOI | Optical detector
Origin: South Korea

Technical parameters
Substrate size: Standard: 350×250mm Large: 500×400mm
Substrate thickness: 0.5mm-3mm
Analytical value: 10 million pixels 2.048×2.048PixelCamera
Test speed: 4 million pixels 4.940mm㎡/sec
Minimum inspection parts: 4 million Pixel 01005 inch/0.3pitch IC   

               0201 inch/0.3pitch IC (can be selected)
Track: Air control/three-stage
power supply: AC 220V, 50/60HZ

Meilu AOI-MV-7L online automatic optical inspection system.

  The MV-7L is fully equipped with a top-view camera and four side-view cameras. Among them, the native resolution of the top-view camera is 4 million pixels (2,048 x 2,048), and the native resolution of the side-view camera is 2 million pixels (1,600 x 1,200). The "Four Corner Illumination System" on this system has been designed to provide four independently programmable zones to provide better lighting within the inspection area. 

      The three-step transfer system provides automatic board support and PCB fixing mechanisms, specifically designed to maximize production line output. Precision motion control system provides excellent reproducibility and repeatability. Additionally, a powerful OCR engine performs part identification detection. MV-7L is specially equipped with ultra-high-speed PCB inspection function, with a maximum speed of 4940 mm per second (7.657 inches per second).

    The revolutionary intelligent scanning laser system provides "three-dimensional detection capability" to precisely measure the Z-axis height of a specific area. This advanced technology provides: lifted pin detection for gull-wing devices, four-point height measurement capability for measuring coplanarity of ball grid array (BGA) and chip scale package (CSP) devices, and more robust soldering Paste measuring capabilities.

    The optional Side View® Camera System adds four 2-megapixel Side View digital color cameras to improve detection of lifted pins and lifted components. The system also provides solder joint inspection for J-lead and leadless chip carrier (LCC) devices.