K&S HYbrid3 high-speed placement machine

Kulicke & Soffa (Nasdaq: KLIC) provides leading semiconductor packaging and electronic assembly solutions to the global automotive, consumer electronics, communications, computer and industrial markets.

As a pioneer in the semiconductor industry, K&S has been committed to providing customers with market-leading packaging solutions for decades. In recent years, K&S has added advanced packaging, electronic assembly, wedge welding machines and other products through strategic acquisitions and independent research and development. At the same time, it has further expanded the product range of consumables in conjunction with its core products.

Combining its rich industry expertise, strong process technology and R&D capabilities, Kulisofa will wholeheartedly help customers meet the challenges of next-generation electronic component packaging.

Quality starting from the board means immediate productivity improvements.
The iX system continues to enhance the overall process of pick and place and introduces a new lightweight feeder to achieve a pick rate of more than 99.99%, passive components (35 micron) With higher placement, camera-aligned component throughput can be increased by 25%.

Through software optimization