1) High-speed, high-precision, multi-functional modular placement machine

2) 0.18 seconds/CHIP ultra-high speed placement (better conditions) 16200CPH (grains/hour)

3) In IPC9850 status, the patching speed is up to 16200CPH (equivalent to 0.22 seconds/CHIP)

4) Installing 0603 components, the overall accuracy can reach ±50 microns, and the full repeatability accuracy can reach ±30 microns.

5) Wide range of applications, from 0201 (inch) micro components to 31mm QFP large components

6) Use 2 high-resolution multi-view digital cameras

7) Continuous solder ball identification of CSP/BGA components, including determination of solder ball defects

8) You can choose YAMAHAzhuanli’s ventilation nozzle, which can effectively reduce the idling loss of the machine

9) A better choice for general use

10) The Y-axis is driven by a high-power servo amplifier and high-rigidity screws at both ends. 

This newly developed fully fixed dual-drive technology accelerates acceleration and coordination

Drive through both ends and complete the acceleration function. Reduce positioning time.

Circuit board size M type: L460*W335 (MAX)-L50*W50 (MIN)

L type: L460*W440(MAX)-L50*W50(MIN)

Installation accuracy accuracy (μ+3σ): ±0.05mm/chip, ±0.05mm/QFP

Installation speed 0.18 seconds/CHIP 1.7 seconds/QFP, 1608/CHIP: 16200CPH

Mountable components 0603-31mm components, SOP/SOJ/QFP/Connectors/PLCC/CSP/BGA

Size 1650*1408*1900

Total weight 1600KG