TOP-X3100

X-RAY X-ray inspection instrument

Application areas

.Inspection of internal structures in IC chips, FC, and CSP packages in the semiconductor field;

.Detection of bubbles and cracks in automobile-related aluminum castings, rubber and resin products;

.Detection and automatic determination of the area size of short circuits, open circuits, and BGA bubble voids in BGA packages of large circuit boards;

.Aerospace and military, wings, warheads, etc.;

.Pharmaceutical-related tablets and chemical products-related FRP, resin, and ceramics;

.Perspective inspection of lithium batteries and electronic components (capacitors, resistors, diodes, LEDs, etc.);

Features

.Original imported foreign vifocal X-ray tube (100/130Kv closed tube), high-sensitivity image intensifier, 1.3 million high-speed industrial digital CCD camera. Can detect samples below 5 microns, with good image display effect;

.High-power geometry and system magnification can be adjusted arbitrarily, making it easy to find subtle defects and the detection speed is fast;

.System laser positioning;

.Four-axis linkage, CNC batch automatic detection function, suitable for large-scale detection, high detection accuracy;

.Multi-functional software system, enjoy lifetime free maintenance upgrades

Technical Parameters

size

1204*1000*1650mm

weight

806KG

power supply

Single phase 110～230V/50～60HZ

Light pipe type

Closed tube

Focus Size

5um

panoramic range

No tilt, optional 360-degree rotating fixture

X-ray output voltage

100KV

Phototube current

0.15MA

Magnification

120 (Geometry)/1000 (System)

Camera lens specifications

Image intensifier + digital CCD 25frame/s

CCD pixels

2 million

System resolution

110 LP/CM (light pair per cm)

Image area

460x360mm

safety

Leakage ≤0.5μsv/h

monitor

19″LCD