135 1032 1270
Shenzhen Tepu Ke Electronic Equipment Co.,Ltd.
Contact: 135 1032 1270 (Miss Jiang)
Mail box: market@topsmt.com
Address: 201, Building 4, Innovation Port, Hanyu Bay, Fuhai Street, Baoan District, Shenzhen
fuji/Fuji chip placement machine XPF-L/W high-speed composite chip placement machine parameters
Machine specifications | Rotating automatic changing head | Single nozzle | M4 automatic replacement head | Dispensing automatic replacement head | |
Number of suction nozzles | 12 | 1 | 4 | Number of glue injection barrels equipped: | |
1/1 adhesive platform | |||||
Automatically change the number of head collections | 2(XPF-L)/3(XPF-W) | 6(XPF-L)/8(XPF-W) | 1 | Number of occupied troughs: | |
(When using the material tray, store 1 automatic replacement head for measuring the height of the material tray) | 8 troughs (MFU-40) | ||||
(The mounting position is fixed | |||||
Can carry up to 4 units) | |||||
Object component | 0402(01005)~20×20mm | 1005(0402)~45×150(68×68)mm | 4 nozzle suction: 3×3~14×14mm | Carrying platform: Side 1 test | |
Height MAX 3.0mm | Height MAX 25.4mm | 2 nozzles for suction: 14×14~ | (MFU-40 or fixed feeding station) | ||
22×26mm | |||||
Height MAX 6.5mm | |||||
Placement cycle | XPF-L | 0.144 sec / piece 25,000 cph | 0.400 sec / piece 9,000 cph | 4 nozzle suction: 0.343 sec / | Coating time: |
10,500 cph | 0.2 sec/shot | ||||
2 nozzle suction: 0.456 sec / | |||||
7,900 cph | |||||
XPF-W | 0.145 sec / piece 24,800 cph | 0.418 sec / piece 8,600 cph | 4 nozzle suction: 0.351 sec / | ||
10,250 cph | |||||
2 nozzle suction: 0.462 sec / | |||||
7,800 cph | |||||
Placement accuracy | Small chip components, etc. | ±0.050mm cpk≧1.00 | ±0.040mm cpk≧1.00 | - | Coating position accuracy: |
±0.066mm cpk≧1.33 | ±0.053mm cpk≧1.33 | ±0.1mm cpk≧1.00 | |||
QFP components | ±0.040mm cpk≧1.00 | ±0.030mm cpk≧1.00 | ±0.040mm cpk≧1.00 | ||
±0.053mm cpk≧1.33 | ±0.040mm cpk≧1.33 | ±0.053mm cpk≧1.33 | |||
Target circuit board size (L × W) | MAX 457mm × 356mm Thickness 0.4 (0.3) ~ 5.0mm (XPF-L) / | ||||
686mm × 508mm Thickness 0.4~6.5mm (XPF-W) MIN 50mm × 50mm | |||||
Board load time | 1.8sec (XPF-L) / 3.5sec (XPF-W) | ||||
Machine size | XPF-L | L: 1,500mm W: 1,607.5mm H: 1,419.5mm (carrying height: 900mm, excluding signal tower) | |||
XPF-W | L: 1,500mm W: 1,762.5mm H: 1,422.5mm (carrying height: 900mm, excluding signal tower) | ||||
Machine weight | Main body XPF-L: 1,500kg / XPF-W: 1,860kg | ||||
MFU-40: Approximately 240kg (when fully loaded with W8 feeder) | |||||
BTU-AII: about 120kg BTU-B: about 15kg MTU-A II: about 615kg (full tray・feeder size) | |||||
Component packaging | ●Material belt components (JIS standard, JEITA), material tube components, material tray components | ||||
Other options | ●Tube feeder ●Wide-angle positioning camera ●Immersion flux unit ●Roll mounting station (built-in type) |
Realized the world's first automatic replacement of work head.
Because it can automatically change from a high-speed working head to a multi-functional working head while the machine is running, all components can always be mounted with a better working head.
The work head for applying adhesive can also be automatically replaced, so that only one machine can be used to apply adhesive and mount components.
By realizing automatic replacement of work heads, the boundaries between high-speed machines and multi-function machines are eliminated (no boundaries).
For all board types, the machine's capabilities can be maximized because the balance between machines is always better
By realizing automatic replacement of work heads, the boundaries between high-speed machines and multi-function machines are eliminated (no boundaries).
For all board types, the machine's capabilities can be maximized because the balance between machines is always better
135 1032 1270
Contact: Miss Jiang
Mail box: market@topsmt.com
Address: 201, Building 4, Innovation Port, Hanyu Bay, Fuhai Street, Baoan District, Shenzhen
Please submit your request and we will call you right back