A brief introduction to JUKI2050 placement machine

JUKI2050 placement machine is suitable for high-speed placement of small components

As a single module in the modular concept, a flexible placement machine production line can be formed according to the production capacity.

■ 13,200CPH: chip (laser identification/actual production efficiency)

■ Laser placement head × 1 (4 nozzles)

■ 0603 (imperial 0201) chip ~ 20mm square component, or 26.5×11mm

0402 (imperial 01005) chip is a factory option

※1 The placement speed may vary depending on the conditions.

While inheriting the advantages of KE series products, it greatly improves the placement speed. In addition, the machine adopts the newly developed high-speed pallet server, which can shorten the pallet replacement time, so it can greatly increase the speed of pallet supply components, thereby achieving the purpose of improving production efficiency.

JUKI2050 placement machine specifications:
13,200CPH: chip (laser identification/actual production efficiency)
laser placement head × 1 (4 nozzles)
0603 (imperial 0201) chip ~ 20mm square component, or 26.5×11mm
0402 (imperial 1005) Chips are factory options. 
Mounting speed conditions vary.
Substrate size:
For M substrate (330×250mm)

For L substrate (410×360mm)

Lwide (510×360mm)

For E substrate (510×460mm)*1

Component size
laser Identification: 0603 chip (British 0201) chip ~ 20mm square component or 26.5×11mm (0402 (British 01005) chip requires option)*5 
Component placement speed: chip component 13,200CPH*2
Component placement accuracy: laser recognition ±0.05mm
Component mounting types: Up to 80 types (converted to 8mm tape)
Device size*3 (W×D×H*4): 1,400×1,393×1,440mm
Weight approx.: 1,400kg