E by DEK fully automatic solder paste printing machine

characteristic:

E by DEK is a modular press platform composed of a series of high-quality modules. The core features of the basic version are a print cycle of only 8 seconds, high-quality stencil bottom cleaning function and easy operation features, aiming to Build broad applications for mid-speed markets. With three option application kits, the platform can be easily upgraded to handle more demanding production applications. Customers can freely combine different packages according to their own needs and complete the upgrade at any time.

E by  DEK printing press parameters:

Calibration rate > 2.0 Cmk @ ± 12.5 μm (± 6 sigma)

Repeatable accuracy > 2.0 Cmk @ ± 25 μm (± 6 sigma)

Printing cycle: 8 seconds

Operating system: Windows 7 Embedded

Squeegee force mechanism: software control, motorized closed-loop control system

Stencil positioning: semi-automatic stencil device

Adjustable Width Stencil Positioning Device: Adjustable Width to Suit Stencil Size Range 381mm to 736mm

Cleaning method at the bottom of the stencil: the stencil cleaning device is programmable wet/dry/vacuum

Substrate size: 50x40.5mm to 620x508.5mm

Substrate thickness: 0.2-6mm

Substrate weight: 6kg

Substrate warpage: 7m, including substrate thickness

Substrate positioner: top pressure side clamp/side clamp/bladeless side clamp/vacuum

Temperature and humidity sensor: monitor process environment